Digital Light Processing (DLP) based photopolymer Additive Manufacturing (AM) is an Additive Manufacturing (3D printing) method using photopolymerization to convert liquid photo-polymeric formulations into solid 3D objects by curing them with UV light in a layer by layer fashion. The addition of all these layers leads to the formation of the 3D object. The light source cures an entire layer in a single pass, generally leading to faster printing speeds. DLP produces highly accurate parts with excellent resolution over multiple length scales (currently 30 µm to 40 cm).
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In chemical mechanical polishing, a surface is smoothened by the combination of chemical and mechanical forces. It is a combined process of chemical etching and free abrasive polishing.
In our lab, we have a Alpsitec E400 E that is designed for polishing and planarization of single wafers with diameters between 1″ and 4″. A new carrier technology opens the range to smaller sizes but also any shape products: square: 10x10mm, quarter of wafers…
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Atomic Layer Deposition (ALD) is a vapor phase chemical deposition method in which various ultrathin films can be deposited with sub-nm thickness control. In a certain temperature and vacuum regime, the deposition can be split up in two, self-terminating half-cycle reactions depositing one monolayer each. The growth is hence independent from exposure time. This effect can be utilized to coat high aspect ratio structures, precisely control composition, create multilayer thin films with sharp boundaries, control film stoichiometry and to control crystal structure.
To be able to adapt to our research challenges, we have built our own ALD tool in the lab. It is designed for 2-inch wafers, up to six different precursors and facilitates processing with O₃, O₂, H₂O and H₂. It is designed for low vapor pressure precursors.
It is currently equipped to process the following films:
Al2O₃, TiO₂, SrO, SrTiO₃

The Woollam M-2000 Spectroscopic Ellipsometer is most commonly used to measure thin film thickness and optical constants. It is sensitive to less than a monolayer of material (sub-nm) on a surface and yet can determine thickness for transparent films up to tens of microns. The M-2000 can also measure the optical constants (both n and k) from any type of material, whether dielectric, organic, semiconductor, or metal. In addition to optical constants, there are additional material properties that can be indirectly determined based on how they affect changes to a material’s optical response.
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